Based on 4-inch wafer product |
Foundry service of 4-inch wafer (Graphene electronic device manufacturing) |
Based on 4-inch wafer product | Foundry service of 4-inch wafer (Graphene electronic device manufacturing) |
Information of foundry service
Fabrication of electrical device | Fabrication processes for semiconductor devices |
Substrate size | Under 6 inch wafer |
Equipment | Photolithography ( resolution > 3um), RIE, ALD, e-beam & thermal evaporator, Sputter, RTA, high vacuum annealing , UV treatment |
Information of substrate
Substrate | Customized various substrate (Need agreements for process development and results) |
Reference
[ Buried-gate GFET ] | [ Top-gate GFET ] |
[ Buried-gate GFET ] | [ Top-gate GFET ] |
Example : Buried gate device fabrication processes
Example : Buried gate device
fabrication processes
➊Substrate preparation
➋SiO₂ dry etch by RIE
➌Metal deposition & lift-off
➍CMP (surface planarization)
➎Gate dielectric deposition
❻Graphene transfer
❼Graphene patterning
❽Electrode metal deposition & patterning
❾Dielectric deposition for Passivation